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Mājas / Ražotāji / Astec America (Artesyn Embedded Technologies) / Piederumi-barošanas avoti - dēļa stiprinājums
Attēls
Daļas numurs
Ražotājs
Apraksts
Izziņa
APA501-60-001
Astec America (Artesyn Embedded Technologies)
HEATSINK (60) 57.5X59X15MM VERT
Izziņa
APA501-60-005
Astec America (Artesyn Embedded Technologies)
HEATSINK (60) 57.5X59X37MM VERT
Izziņa
APA501-80-003
Astec America (Artesyn Embedded Technologies)
HEATSINK (80) 115X59X22.5MM VERT
Izziņa
APA501-80-001
Astec America (Artesyn Embedded Technologies)
HEATSINK (80) 115X59X15MM VERT
Izziņa
APA501-80-005
Astec America (Artesyn Embedded Technologies)
HEATSINK (80) 115X59X37MM VERT
Izziņa
APA502-60-001
Astec America (Artesyn Embedded Technologies)
PAD THERMAL SIZE60 FOR AMPSS MOD
Izziņa
APA501-80-002
Astec America (Artesyn Embedded Technologies)
HEATSINK (80) 115X59X15MM HORZ
Izziņa
APA501-60-002
Astec America (Artesyn Embedded Technologies)
HEATSINK (60) 57.5X59X15MM HORZ
Izziņa
APA502-80-001
Astec America (Artesyn Embedded Technologies)
PAD THERMAL SIZE80 FOR AMPSS MOD
Izziņa
APA501-80-007
Astec America (Artesyn Embedded Technologies)
HEATSINK (80)115.6X89X12MM LOPRO
Izziņa
APA501-60-007
Astec America (Artesyn Embedded Technologies)
HEATSINK (60)57.2X89X12MM LO PRO
Izziņa
APA501-60-003
Astec America (Artesyn Embedded Technologies)
HEATSINK (60)57.5X59X22.5MM VERT
Izziņa
APA504-00-001
Astec America (Artesyn Embedded Technologies)
SOCKET SPRING(20-CONTROL/15-PWR)
Izziņa
LGA-HTSK-KIT-045
Astec America (Artesyn Embedded Technologies)
LGA ACC KIT
Izziņa
APA501-80-004
Astec America (Artesyn Embedded Technologies)
HEATSINK (80) 115X59X22.5MM HORZ
Izziņa
LGA-HTSK-KIT-048
Astec America (Artesyn Embedded Technologies)
LGA ACC KIT
Izziņa
APA501-00-001
Astec America (Artesyn Embedded Technologies)
HEATSINK AAXXC 75X75X20MM 3.5C/W
Izziņa
LGA-HTSK-KIT-050
Astec America (Artesyn Embedded Technologies)
LGA ACC KIT
Izziņa
APA501-60-006
Astec America (Artesyn Embedded Technologies)
HEATSINK (60) 57.5X59X37MM HORZ
Izziņa
APA503-00-001
Astec America (Artesyn Embedded Technologies)
STUD MTG TAPPED FOR HEATSINK
Izziņa
APA501-80-006
Astec America (Artesyn Embedded Technologies)
HEATSINK (80) 115X59X37MM HORZ
Izziņa
3780200600
Astec America (Artesyn Embedded Technologies)
PAD THERMAL 1/4 BRICK
Izziņa
APA503-00-008
Astec America (Artesyn Embedded Technologies)
STUD MTG SOLDER FOR HEATSINK LP
Izziņa
APA503-00-007
Astec America (Artesyn Embedded Technologies)
STUD MTG TAPPED FOR HEATSINK LP
Izziņa
3780000200
Astec America (Artesyn Embedded Technologies)
PAD THERMAL 1/2 BRICK
Izziņa
APA503-00-002
Astec America (Artesyn Embedded Technologies)
STUD MTG SOLDER FOR HEATSINK
Izziņa
APA501-60-004
Astec America (Artesyn Embedded Technologies)
HEATSINK (60)57.5X59X22.5MM HORZ
Izziņa
APA501-60-001
Astec America (Artesyn Embedded Technologies)
HEATSINK (60) 57.5X59X15MM VERT
Izziņa
APA501-60-005
Astec America (Artesyn Embedded Technologies)
HEATSINK (60) 57.5X59X37MM VERT
Izziņa
APA501-80-003
Astec America (Artesyn Embedded Technologies)
HEATSINK (80) 115X59X22.5MM VERT
Izziņa
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