PCB+SMT - Nantian Electronics

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PCB Capabilities

Items	Capability		Items	Capability
	Template	Batch	Material	FR4 / Hi-Tg / Rogers / Halogen Free / RCC PTFE / Nelco / Mixed lamination Materials
Number of Layers	2-64 L	2-58 L	Material
Board Thickness	0.5-17.5mm	0.6-10mm	Surface Treatment	HASL、HASL PB FREE Immersion Gold/Tin/Silver Gold Finger Plating OSP、Immersion Gold + OSP
Number of Layers	2-64 L	2-58 L
Annular Ring - Min	2-64 L	2-58 L
HDI Type	1+n+1 \ 2+n+2 3+n+3	1+n+1 \ 2+n+2	Other Techniques	Blind and Buried Vias / Step groove / metal substrate / embedded resistor / embedded capacitor / mixed pressure / soft and hard combination / back drill / step gold finger
Spacing/Tracing - Min	2-64 L	2-58 L
Maximum Layer Copper Thickness	2-64 L	2-58 L
Home Aperture Ratio	Template	Batch	PCBA Capacity	31.5 million Solder Joints/day
Maximum PCB Size	650mm X 1130mm	610mm X 1100mm	PCBA Production line	30Article
Impedance Control	+/-5%	+/-10%